Toshiba Computer Technology Corporation Circuit Board Inspection
We will design and manufacture a functional inspection device for the substrate. Stress testing and reliability evaluation will be conducted as needed.
We conduct functional inspections of substrates, stress tests, and reliability evaluations of soldered areas, and we respond quickly to identify (analyze) the failure points of defective substrates and repair them. Additionally, by identifying the causes of defects and providing feedback, we contribute to improving the yield of mass-produced products and enhancing market quality.
- Company：東芝コンピュータテクノロジー 本社
- Price：Other
